An Enhanced Quasi-Monolithic Integration Technology for Microwave and Millimeterwave Applications

Joodaki, Mojtaba

kassel university press, ISBN: 978-3-89958-010-5, 2003, 158 Pages

URN: urn:nbn:de:0002-0104

Zugl.: Kassel, Univ., Diss. 2003

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Content: In this dissertation different structures of the earlier concept of quasi-monolithic integration technology (QMIT) have been investigated in details and further required developments have been addressed. To fulfill these requirements and reach a flexible technology owning several advantages, two new fabrication processes for QMIT named the enhanced QMIT for the coplanar and microstrip circuit realizations have been introduced. The enhanced QMIT can be considered as an organic deposited MCM, which uses common thin-film interconnection for the first level of packaging (device-to-package) for RF, microwave and millimeterwave applications.

In the enhanced QMIT large-area high-Q passive elements can be fabricated on a low cost silicon substrate covered by organic multiplayer dielectrics. Beside many other advantages such as small size and weight, good lifetime and reliability, capability of MCM integration, using active devices based on different materials, good control of parasitic elements, compatibility with coplanar waveguides without using thin devices and broad-band performance, the extremely low thermal resistance and direct electrical interconnects to the embedded active devices giving minimum parasitic effects, are unique advantages of this technology.

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